Economic Observation Network The company has made significant progress in the key field of high bandwidth storage (HBM). According to industry insiders on April 13th, Samsung Electronics has completed a demonstration test of the HBM hot press bonding machine (TCB) with ASMPT and has decided to proceed with the next phase of the Joint Evaluation Project (JEP) This marks ASMPT's advantageous position in Samsung Electronics' HBM key equipment supply chain diversification strategy. Caitong Securities pointed out that the company aims to capture 35% -40% of the TCB market share to consolidate its leading position, and has obtained multiple customer orders applied to HBM4-12Hi, achieving breakthroughs in the industry first ?

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