Xinchi Technology has completed a 1 billion yuan Series C financing, and Huadeng Group has once again increased its investment

Domestic automotive grade chip supplier Xinchi Technology recently announced the completion of C+and C++round financing, with a C round financing of approximately 1 billion yuan to be completed in 2026. The financing parties include Huadeng Technology, Shaanxi Investment Fund, Shaanxi Jinzi, New Era Capital, etc. Huadeng International, the global parent brand of Huadeng Technology, is one of the most influential investment institutions in the global semiconductor industry chain. It entered the market during the angel round investment of Xinchi Technology, and its subsequent Series A and Series C financing were completed by its RMB funds, Zhongdian Huadeng and Huadeng Technology, respectively. The Huadeng series mainly focuses on the stable car chip basic disk of Xinchi Technology, as well as the second curve growth space opened up by embodied intelligence. In 2025, among local chip manufacturers, Xinchi Technology's intelligent cockpit SoC and high-performance vehicle control MCU will rank first in terms of market share. At this year's Shanghai Auto Show, Xinchi Technology announced its transition from driving intelligence to general intelligence, officially entering the field of embodied intelligent robot chips. It released a complete brain cerebellum torso joint full stack chip solution at once and announced cooperation with partners such as Galaxy General Robot. This round of financing will focus on core technology research and development and productization, including accelerating the extension to intelligent terminal scenarios such as embodied intelligence, and deepening cross scenario technology layout.